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Key words:

Single and double layers| Four-layer board| Six-layer board| Copper base/Aluminum substrate|

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Manufacture Capability

MCPCB Series

PCB Series

PCBA Series

Product Model

Aluminum-Based PCB, Copper Based

Material/Model

lmported Al:USA(ALCOA)/Japan; Domestic Al

A1060 A3003 A5052 A6061

Surface finish

HASL, HASL(lead Free)/OSP/Immersion Gold/ Immersion Silver/Chemical Tin

LayersSingle-sided/Double-Sided/4 Layer Al Based
Maximum size1200mm* 600mm
Minimum size5mm*5mm
Line Width/Space≥0.1mm
Warp and Twist≤0.5% (thickness)
Processing Thickness0.3-4.5mm
Copper Foil thickness35um, 70um, 105um, 140um, 175um
Molding Dimension Tolerance+/-0.15mm
V-cut Positioning Accuracy+/-0.1mm
Processing Capacities15,000 sq meter
Cu thickness of inner Aperture20-25um
Hole Location Deviation+/-0.076mm
Min Diameter of Piercing

≤1.0mm

1.2-3.0mm 1.5mm

Min Specification of the Square Groove

Plate thickness<1.0mm: 0.8mm*0.8mm

Plate thickness: 1.2-3.0mm, 1.0mm* 1.0mm

Circuit Printing Deviation+/-0.076mm
Scope of Molding Dimension ToleranceCNC:+/-0.1MM  Punching:+/-0.15mm
Min Hole Size0.8mm
Max Hole SizeNo Limited
Coating thickness

Gold Plating: Ni 2-5um, Au 0.05-0.1um, 0.025-0.075um

lmmersion Gold: Ni 5-8 um Au 0.08-0.1um

V-cut Angle Tolerance

+/-5

Smallest window of Pad0.01mm

Layers

1-30L

Material Types

FR-4, CEM-1, CEM-3, High-TG etc.

Max.Panel Dimension

646mm*1200mm

Outline Tolerance±0.10mm
Board Thickness0.2mm-6.0mm
Board Thickness Tolerance±10%
Dielectric Thickness0.075mm-0.20mm
Min.Track Width0.075mm
Min. Track Space0.075mm
External Cu Thickness18um-210um (HOZ-6OZ)
lnternal Cu Thickness18um-210um (HOZ-6OZ)
Drilling Bit Size(CNC)0.15mm-6.50mm
Finished Hole Dimension0.1mm-6.0mm
Hole Tolerance±0.05mm
Hole Position Tolerance±0.05mm
Laser Drilling Hole Size0.075mm
Solder MaskGreen, Blue, White,Black,Red , Yellow, Purple,ect
Min SolderMaskBridge0.05mm
Plugged Hole Diameter0.20mm-0.50mm
lmpedance Control±10%
Surface FinishingHASL, HASL(lead Free), ImmersionGold, lmmersion Tin, lmmersionsilver,OSP

Dimension

Min 50*40"0.38mm

Max 600*400*4.2

Weight

1.8KG

Special dimension

1200*400*4.2mm

Material

FR-4, CEM-1, CEM-3, Aluminium-based board

Surface finish

HAL, OSP, Immersion gold, Flash Gold Finger

Chip&IC

Min 0201(0.5*0.25)

Max 55mm

BGA Pitch0.3mm
QFP Pitch0.3mm
Product Type: SMT

Qty: 5~200

Normal lead time: 2WD

Quick-turn Lead time: 8H

Product Type: SMT

Qty: 201~2000

Normal lead time: 3-5 WD

Quick-turn Lead time: 2WD

Product Type: SMT+DIP

Qty: ≥22000

Normal lead time: 6WD

Quick-turn Lead time: 3WD

Product Type: SMT+DIP

Qty: 5~200

Normal lead time: 3WD

Quick-turn Lead time: 2WD

Product Type: SMT+DIP

Qty: ≥22000

Normal lead time: ≥22000

Quick-turn Lead time: 5WD

Different Metal core Materials

BrandBOYU
(3003)
TOTKING
(5052)
Ventec
(5052)
Polytronics
(6061)
Bergquist
(6061)
Thickness(mm)0.8-5.00.5-3.20.5-3.01.0-3.01.0-3.0
Copper(OZ)1-15H-101/3-101-61-5
Dielectric layer (UM)70-10075-20075-18075-18075-150
Thermal Conductivity (W/m*K)1.0-3.01.5-3.02.0-4.22.0-12.02.2-5.0
Application


Tube Light, Panel light, Bulb light and Down light Low power ≤100W)


Street Light, High Bay light (High Power ≥100W)


Street Light (High Power ≥100W)


Street Light/High Bay Light/Power Supply/LED grow light (High Power ≥100W)


Street Light/ High Bay Light/ Power Supply (High Power ≥100W)


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