Product Model | Aluminum-Based PCB, Copper Based |
Material/Model | lmported Al:USA(ALCOA)/Japan; Domestic Al A1060 A3003 A5052 A6061 |
Surface finish | HASL, HASL(lead Free)/OSP/Immersion Gold/ Immersion Silver/Chemical Tin |
Layers | Single-sided/Double-Sided/4 Layer Al Based |
Maximum size | 1200mm* 600mm |
Minimum size | 5mm*5mm |
Line Width/Space | ≥0.1mm |
Warp and Twist | ≤0.5% (thickness) |
Processing Thickness | 0.3-4.5mm |
Copper Foil thickness | 35um, 70um, 105um, 140um, 175um |
Molding Dimension Tolerance | +/-0.15mm |
V-cut Positioning Accuracy | +/-0.1mm |
Processing Capacities | 15,000 sq meter |
Cu thickness of inner Aperture | 20-25um |
Hole Location Deviation | +/-0.076mm |
Min Diameter of Piercing | ≤1.0mm 1.2-3.0mm 1.5mm |
Min Specification of the Square Groove | Plate thickness<1.0mm: 0.8mm*0.8mm Plate thickness: 1.2-3.0mm, 1.0mm* 1.0mm |
Circuit Printing Deviation | +/-0.076mm |
Scope of Molding Dimension Tolerance | CNC:+/-0.1MM Punching:+/-0.15mm |
Min Hole Size | 0.8mm |
Max Hole Size | No Limited |
Coating thickness | Gold Plating: Ni 2-5um, Au 0.05-0.1um, 0.025-0.075um lmmersion Gold: Ni 5-8 um Au 0.08-0.1um |
V-cut Angle Tolerance | +/-5 |
Smallest window of Pad | 0.01mm |
Layers | 1-30L |
Material Types | FR-4, CEM-1, CEM-3, High-TG etc. |
Max.Panel Dimension | 646mm*1200mm |
Outline Tolerance | ±0.10mm |
Board Thickness | 0.2mm-6.0mm |
Board Thickness Tolerance | ±10% |
Dielectric Thickness | 0.075mm-0.20mm |
Min.Track Width | 0.075mm |
Min. Track Space | 0.075mm |
External Cu Thickness | 18um-210um (HOZ-6OZ) |
lnternal Cu Thickness | 18um-210um (HOZ-6OZ) |
Drilling Bit Size(CNC) | 0.15mm-6.50mm |
Finished Hole Dimension | 0.1mm-6.0mm |
Hole Tolerance | ±0.05mm |
Hole Position Tolerance | ±0.05mm |
Laser Drilling Hole Size | 0.075mm |
Solder Mask | Green, Blue, White,Black,Red , Yellow, Purple,ect |
Min SolderMaskBridge | 0.05mm |
Plugged Hole Diameter | 0.20mm-0.50mm |
lmpedance Control | ±10% |
Surface Finishing | HASL, HASL(lead Free), ImmersionGold, lmmersion Tin, lmmersionsilver,OSP |
Dimension | Min 50*40"0.38mm Max 600*400*4.2 |
Weight | 1.8KG |
Special dimension | 1200*400*4.2mm |
Material | FR-4, CEM-1, CEM-3, Aluminium-based board |
Surface finish | HAL, OSP, Immersion gold, Flash Gold Finger |
Chip&IC | Min 0201(0.5*0.25) Max 55mm |
BGA Pitch | 0.3mm |
QFP Pitch | 0.3mm |
Product Type: SMT | Qty: 5~200 Normal lead time: 2WD Quick-turn Lead time: 8H |
Product Type: SMT | Qty: 201~2000 Normal lead time: 3-5 WD Quick-turn Lead time: 2WD |
Product Type: SMT+DIP | Qty: ≥22000 Normal lead time: 6WD Quick-turn Lead time: 3WD |
Product Type: SMT+DIP | Qty: 5~200 Normal lead time: 3WD Quick-turn Lead time: 2WD |
Product Type: SMT+DIP | Qty: ≥22000 Normal lead time: ≥22000 Quick-turn Lead time: 5WD |
Brand | BOYU (3003) | TOTKING (5052) | Ventec (5052) | Polytronics (6061) | Bergquist (6061) |
---|---|---|---|---|---|
Thickness(mm) | 0.8-5.0 | 0.5-3.2 | 0.5-3.0 | 1.0-3.0 | 1.0-3.0 |
Copper(OZ) | 1-15 | H-10 | 1/3-10 | 1-6 | 1-5 |
Dielectric layer (UM) | 70-100 | 75-200 | 75-180 | 75-180 | 75-150 |
Thermal Conductivity (W/m*K) | 1.0-3.0 | 1.5-3.0 | 2.0-4.2 | 2.0-12.0 | 2.2-5.0 |
Application | Tube Light, Panel light, Bulb light and Down light Low power ≤100W) | Street Light, High Bay light (High Power ≥100W) | Street Light (High Power ≥100W) | Street Light/High Bay Light/Power Supply/LED grow light (High Power ≥100W) | Street Light/ High Bay Light/ Power Supply (High Power ≥100W) |