1. Function and characteristics PCB (the abbreviation of English PrintedCircuieboard printed lineboard) is used as a coating of nickel plating as a substrate of precious metals and cheap metals. For some single -sided printed boards, it is also often used as a surface layer. For some surfaces that have been worn over load, such as switching contacts, tacticals, or plug gold, nickel uses nickel as a substrate plating of gold, which can greatly improve wear resistance. When used as a blocking layer, nickel can effectively prevent the diffusion between copper and other metals. Dumb nickel/gold combination coating is often used as a metal coating for corrosion, and it can adapt to the requirements of heat pressure welding and welding. Only nickel can be used as a corrosion coating for ammonia -containing agents, instead of heat pressure welding, no heat pressure welding is not required. The bright PCB of the plating layer is also required, and the light nickel/gold plating layer is usually required. Nickel plating thickness is generally not less than 2.5 microns, and usually 4-5 microns are usually used.

PCB low -stress nickel deposition layer is usually plated with modified Wat nickel plating solution and some amino sulfonic acid nickel plating fluids with additives that reduce stress.

The PCB nickel -plated nickel has light nickel and dumb nickel (also known as low stress nickel or semi -light nickel). It is usually required to be uniform and meticulous, low pore rate, low stress, and good ductility.

2. Nickel (Nickel) Nickel (Nickel) Nickel Sulfate Nickel is widely used as a metal -plating and printed plug -in -on -chip substrate plating. The internal stress, high hardness, high hardness, and extremely superior ductility obtained. Add a dehuminating agent to the plating fluid, the obtained coating will be slightly stressful. There are a variety of different formulas of amino sulfonate plating liquid, and the typical amino sulfonic acid nickel plating formula is shown in the following table. Due to the low stress of the coating, it has been widely used, but the stability of nickels of amino sulfonate is poor, and its cost is relatively high.

3. Modified wat nickel (nickel nickel) modifiers of the tart nickel formula, nickel sulfate, together with nickel bromide or nickel chloride. Due to internal stress, most of them use nickel bromide. It can produce a semi -bright, slightly internal stress, and ductility of plating; and this coating is easy to activate and the cost is relatively bottomed.

4. The role of each component of the plating solution:

Main salt -nickel and nickel sulfate in amino sulfonate is the main salt in nickel liquid. Nickel salt mainly provides nickel -plated nickel -plated nickel metal ions and has the effect of conductive salt. The concentration of nickel plating solution is slightly different with the supply manufacturers, and the allowable content of nickel salt is greater. The nickel salt content is high, the higher cathode current density can be used, the deposition speed is fast, and it is often used as a high -speed thick nickel -plated thick nickel. However, excessive concentration will reduce the cathode polarization, poor decentralization ability, and large loss of the plating fluid. The nickel salt content is low, but the dispersion ability is very good, and the crystallization is fine and bright.