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Several common surface treatment methods of PCB samples

Time:2023-02-09 Visit:


1. HASL hot air is flat (that is, tin spray often)

Tin spray is a commonly used treatment method for PCB samples. It is now divided into lead spray tin and lead -free tin. Advantages of tin spray: After the PCB is completed, the surface of the copper is completely wet (tin is completely covered before welding), suitable for lead -free welding, low process maturity cost, suitable for visual inspection and electricity test, and also high -quality and reliable PCB board One of the ways to deal with.


2. Chemical Nickel Gold (Enig)

Nickelization gold is a relatively large PCB sample surface treatment process. Remember: Nickel layer is a nickel -phosphorus alloy layer. According to the phosphorus content, it is divided into high phosphorus nickel and medium phosphorus. the difference. Advantages of nickel -mocofile gold: suitable for lead -free welding; the surface is very flat, suitable for SMT, suitable for electricity testing, suitable for switching contact design, suitable for aluminum line binding, suitable for thick plates, resistance to environmental attack strong.

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3. Nickel gold

Electro -plated gold is divided into "hard gold" and "soft gold". Hard gold (such as: gold cobalt alloys) is often used on the gold finger (contact connection design). Soft gold is pure gold. Electro -plating gold is applied with many applications on the IC carrier board (such as PBGA). It is mainly used to binding gold and copper wires. However, the load -load plate electroplating is suitable. Binding the golden finger area requires additional conductivity to electroplating. Advantages of electroplating nickel gold PCB plate sample: suitable for contact switch design and golden line binding; suitable for electricity testing


4. Nickel Gold (ENEPIG)


Nickel Gold has gradually begun to apply in the field of PCB samples, and has previously applied more in semiconductors. Suitable for alloy, aluminum line binding. The advantages of nickel -p 用 PCB sample: Apply on the IC carrier, suitable for alloy line binding, aluminum line binding. Suitable for lead -free welding; compared with Enig, there is no nickel corrosion (black disk) problem; cost is cheaper than ENIG and nickel gold, suitable for multiple surface treatment processes and exist on board.