The first-class production comes from the first-class design. Zhongke circuit board manufacturers can not do without your design cooperation. Each engineer should design according to the detailed explanation of the conventional production process.

Detailed explanation of relevant design parameters:

1、 Via

1. Minimum aperture: 0.2mm (8mil)

2. The minimum through-hole (VIA) aperture shall not be less than 0.2mm (8mil), and the single side of the pad shall not be less than 6mil (0.153mm). If it is better to be larger than 8mil (0.2mm), it is not limited to this point. It must be considered in the design.

3. The distance between vias (VIA) and holes (hole edge to hole edge) shall not be less than: 6mil is better than 8mil, which is very important and must be considered in design.

4. The distance between bonding pad and contour line is 0.508mm (20mil).

2、 Line

1. Minimum line spacing: 3mil (0.075mm). The minimum line distance is the line to line distance. The line to pad distance is not less than 6mil. From the production point of view, the larger the distance, the better. Generally, it is 10mil. Of course, the larger the distance is, the better this point is very important. The design must consider

2. Minimum line width: 3mil (0.075mm). That is to say, if the line width is less than 6mil, it can not be produced. (The minimum line width and line spacing of the inner layer of a multilayer circuit board is 8MIL) If the design conditions permit, the larger the design, the better the line width is. Our circuit board factory can produce as much as possible. The higher the yield, the more important the general design convention is about 10mil. The design must be considered

3. Distance from line to outline 0.508mm (20mil)

3、 PAD pad (commonly known as plug-in hole (PTH))

1. One side of the outer ring of the insert hole (PTH) pad cannot be less than 0.2mm (8mil). Of course, the larger the better, this is very important, and must be considered in the design.

2. The hole to hole spacing (hole edge to hole edge) of the plug-in hole (PTH) must not be less than 0.3mm. Of course, the larger the better, this is very important, and must be considered in the design.

3. The size of the plug-in hole depends on your components, but it must be larger than your component pin. It is recommended that the component pin larger than at least 0.2mm, that is, 0.6, should be designed to 0.8 at least, in order to prevent difficult insertion due to processing tolerance.

4. The distance between bonding pad and contour line is 0.508mm (20mil).

4、 Anti soldering

1. One side of SMD window opening shall not be less than 0.1mm (4mil).

5、 Character (the design of characters directly affects the production, and whether the characters are clear depends on the character design).

1. The character width shall not be less than 0.153mm (6mil), the character height shall not be less than 0.811mm (32mil), and the ratio of width to height shall preferably be 5, that is, the character width shall be 0.2mm, and the character height shall be 1mm.

6、 The minimum spacing of non-metallic slot holes shall not be less than 1.6mm, otherwise it will greatly increase the difficulty of edge milling.

7、 Patchwork

1. There is no gap in the plate assembly, and there is gap in the plate assembly. The gap in the plate assembly with gap should not be less than 1.6 mm (1.6 plate thickness), otherwise it will greatly increase the difficulty of edge milling. The size of the plate assembly work varies depending on the equipment. The gap in the plate assembly without gap should be about 0.5 mm, and the process edge should not be less than 5 mm.