The circuit part of the PCB substrate and the thermal layer part are on different circuit layers, and the thermal layer part directly contacts the heat dissipation part of the lamp bead to achieve the best heat dissipation (zero thermal resistance) effect. The material of the substrate is generally a copper substrate.

advantage:

1. Select copper substrate: high density, strong thermal conductivity of the substrate itself, good thermal conductivity and heat dissipation.

2. The thermoelectric separation structure is adopted: zero thermal resistance contacts the lamp beads, reduces the weak light of the lamp beads, and maximizes the life of the lamp beads.

3. The PCB copper substrate has high density, strong thermal conductivity, and smaller volume under the same power.

4. It is suitable for matching with a single high-power lamp bead, especially the COB package, so that the lamp can achieve better results.

5. Various surface treatments (immersion gold, OSP, tin spraying, silver plating, immersion silver, immersion tin) can be carried out according to different needs, and the surface treatment layer has excellent reliability.

6. Different structures (copper bumps, copper concave blocks, parallel heat dissipation and