The process first requires positioning holes for positioning and punching. Electroplating the first drilled PCB, sealing the positioning holes with dry film before electroplating, making the outer layer pattern during the plating process, after the outer layer pattern is formed, perform pattern plating on the printed circuit board PCB, and use dry film sealing and positioning before pattern plating hole. Then backdrill the positioning with the pilot hole used with the first drill bit, and backdrill the plated holes that need to be backdrilled with the drill bit. Lastly, the drill bit needs to be cleaned, as the drill bit retains cuttings during the backdrilling process.

Advantages of Back Drilling

Reduce noise disturbance.

Improve signal integrity.

Reduce the use of buried blind vias and reduce the difficulty of PCB manufacturing.

Lower cost compared to sequential lamination.

Increase channel bandwidth

data rate increase

Reduce the use of buried and blind vias and reduce the difficulty of PCB production

Features of Back Drill