There are also many varieties of silicone resin coating materials for pcb printed circuit boards, such as heat curing solution, 100% moisture curing solution, 100% UV curing solution, solvent type, etc.

In the past, pcb printed circuit boards coated with silicone resin assembly boards were difficult to repair, because these formulated material products could not be dissolved in solvents or evaporated by heating with ferrous iron. However, the silicone resin can now be removed by chemical stripping, effectively dissolving the silicone coating.

Newly developed materials industry efforts to shorten production cycles and reduce or completely eliminate solvent volatilization have led to the development of new coating formulations, including many UV-curable coatings and coatings that use VOC-free solvents.

Users should carefully weigh the disadvantages of the new material relative to the original Pcb printed circuit board coating material, such as the advantages of low wetting, adhesion and chemical resistance. Perhaps most important to users is their limited "usage record", which requires experimentation to establish acceptable performance metrics.

Silicone resin conformal coatings for printed circuit boards are particularly suitable for high temperature applications with operating temperatures up to 200°C. Silicone resin material has high moisture resistance, high corrosion resistance and good heat resistance, so it is an ideal coating material for printed board assembly containing high heating elements (such as high power resistors). However, the adhesive strength of silicone resin materials is low, the coating is easy to peel off, and the thermal expansion coefficient is high.