a) The device footprint library requires the use of the wave pad library.

b) The axial direction of the SOP device should be consistent with the direction of the wave crest.

c) For SOP devices, add a pair of d5/2 wide steal tin pads at a distance (D+3/2d) behind the center of the wave end pad. where D is the distance between the centers of the two pads and d is the width of the pads.

d) Chip

Devices using the Crest Pad Library have no special requirements for the orientation of the crest.

e) The bottom of the device should be routed as far as possible to increase the dispensing height. When the value of Stand Off is not ideal, virtual routing is required.

Layout Requirements for General Purpose Wave Soldering

a) Devices with pitch ≥2.0mm and pad margin ≥40mil are preferred. On the premise that the device bodies do not interfere with each other, the distance between the edges of adjacent device pads should be ≥40mil.

b) When the number of pins in each row of THD is large, the devices should be arranged in the direction of the pads parallel to the direction of the board. When there are special requirements for the layout, when the pad arrangement direction is perpendicular to the board direction, appropriate measures should be taken in the pad design to improve the process window, such as the application of elliptical pads. When the margin between adjacent pads is 0.6mm-1.0mm (24-40mil), it is recommended to use oval pads or tinned pads.

Layout Requirements for Selective Wave Soldering

a) No other solder joints or SMT devices shall be placed within the 5.0mm area around the center of the solder joint that requires a single treatment.

b) The center-to-center distance of single-row multi-pin through-hole devices to be soldered shall not be less than 1.27mm, and no other solder joints or SMT device solder joints shall be arranged within 3.0mm from the center. For spacers, the pads need to be covered with green oil or designed without pads.

c) If the single-row multi-pin through-hole device to be soldered only has SMT devices and pads arranged on one side, the processing capabilities of different device arrangement directions are different. The minimum edge-to-edge spacing of processable pads is 2.0mm when the device is aligned parallel to the pad to be soldered. If the device is aligned perpendicular to the pads, the minimum machinable pad edge spacing is 1.0mm.

d) For multi-row punched devices that need to be soldered, the pin center distance of multi-row through-hole devices is ≥1.27mm, and other solder joints or SMT devices cannot be arranged within 3.0mm from the center.