With the accelerated investment and expansion of Chinese wafer fabs and the advancement of the independent and controllable national strategy of the semiconductor industry, the domestic demand for IC substrates will grow rapidly. According to data, the total operating income of my country's IC substrate industry in 2020 is about 4.035 billion yuan, a year-on-year increase of 6.07%. "

PCB is mainly divided into rigid board (including single-layer board, double-layer board and multi-layer board), HDI board, IC carrier board, flexible board, rigid-flex board, with different materials, functions and application fields. In recent years, with the continuous development of industries such as smart terminals, smart wearable devices, 5G and cloud computing, the market demand for flexible boards, rigid-flex boards, HDI boards, and IC substrates has continued to grow.

In terms of subdivided product structure, ordinary multi-layer boards occupy 44.77% of the market share of circuit board factories, HDI boards occupy 21.23% of the market share, and flexible boards occupy 22.62% of the PCB industry market share.

The IC carrier board is developed based on the HDI board. It has the characteristics of high density, high performance and thinness. It is an upgrade of the traditional integrated circuit packaging lead frame and is used in various chip packaging links. In recent years, as the integrated circuit industry is getting closer to the direction of small size and high integration, IC packaging is also developing in the direction of ultra-multi-pin, ultra-miniaturization and narrow pitch. According to relevant data, the global output value of IC substrates will reach US$10.188 billion in 2020, mainly due to the rapid growth of global integrated circuit sales in 2020. In the context of the rapid growth of downstream industries, the demand for IC substrates has increased significantly.