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What are the characteristics of immersion gold pcb?

Time:2022-07-06 Visit:


 1. Because the crystal structures formed by immersion gold and gold plating are different, immersion gold is easier to weld than gold plating, and it will not cause poor welding and cause customer complaints.

    2. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold will be more golden yellow than gold plating, and customers are more satisfied.

    3. Because immersion gold has a denser crystal structure than gold plating, it is not easy to produce oxidation.

    4. Since the immersion gold board only has nickel gold on the pad, the transmission of the signal in the skin effect is in the copper layer and will not affect the signal.

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    5. Since the immersion gold board only has nickel-gold on the pad, the combination of the solder mask on the circuit and the copper layer is stronger.

    6. Because the immersion gold plate only has nickel gold on the pad, it will not produce gold wire and cause slight short.

    7. Because the crystal structure formed by immersion gold and gold plating is different, the stress of the immersion gold plate is easier to control, and for products with bonding, it is more conducive to bonding processing. At the same time, it is precisely because immersion gold is softer than gold plating, so the gold finger of immersion gold plate is not wear-resistant.

    8. The project will not affect the spacing when making compensation.

    9. The flatness and standby life of the immersion gold plate are as good as those of the gold-plated plate.