With the rapid development of the electronics industry, PCB wiring is becoming more and more precise. Many PCB manufacturers use dry film to complete the pattern transfer, and the use of dry film is becoming more and more popular, but in reality we will still encounter many customers using There are many misunderstandings when drying the film. The editor of Huashengxin Shenzhen PCB Factory will talk about the solution to the hole in the dry film in detail and the reason for the seepage of the dry film.

We always want to maintain the toughness of the dry film, so when the dry film is broken, we can make improvements from the following points: reduce the film temperature and pressure; improve the roughness and front of the hole wall; increase the exposure energy; reduce the development The pressure of the film can not be parked for too long after the film is applied, so as not to cause the semi-fluid film to spread and thin at the corners; when filming, the dry film we use should not be stretched too tightly. There is also seepage during dry film electroplating, indicating that the dry film and the copper foil are not firmly adhered, so that the electroplating solution enters. Seepage plating is caused by the following bad reasons? The film temperature is high or low; the film pressure is high or low; the exposure energy is high or low.