According to the number of layers and the development direction of PCB, the PCB industry is divided into 6 main subdivision products such as single-sided, double-sided, conventional multi-layer boards, flexible boards, HDI (high-density interconnection) boards, and packaging substrates. From the perspective of the four cycle dimensions of the product life cycle, "introduction period-growth period-mature period-decline period", single-sided and double-sided panels are in decline because they are not suitable for the current application trend of short, light and thin electronic products. The proportion is gradually decreasing. Developed countries and regions such as Japan, South Korea and Taiwan have rarely produced such products locally, and many large manufacturers have made it clear that they will no longer accept single and double panels. Conventional multi-layer boards and HDI are mature products, with increasingly mature process capabilities and high added value of products, which are the main supply directions of most major PCB factories at present. Among Chinese manufacturers, only a few such as ultrasonic electronics have mastered production technology; Flexible boards, especially high-density flexible boards and rigid-bonded boards, have not been able to achieve mass production by a large number of manufacturers because the current technology is not yet mature. Characteristics, the growth of flexible boards is very high, which is the future development direction of various manufacturers.

The packaging substrates used in ICs are relatively mature in developed countries such as Japan and South Korea in both R&D and manufacturing, but they are still in the stage of technological exploration in China. Only Yifei Electric (Beijing) Co., Ltd., ASE Semiconductor (Shanghai) Co., Ltd., Zhuhai Doumen Chaoyi Electronics Co., Ltd. and a few other manufacturers are producing in small batches. This is because my country's IC industry is still very underdeveloped, but with the continuous relocation of IC R&D institutions to China by multinational electronics giants and the improvement of China's own IC R&D and manufacturing level, packaging substrates will have a huge market, which is a visionary The development direction of the factory. China's rigid boards (single-sided, double-sided, multi-layer boards, HDI boards) accounted for 70%, of which the multi-layer boards with a proportion of more than 50% accounted for the largest proportion, followed by flexible boards with a proportion of 15.6%. Due to the pressure of oversupply, most manufacturers entered a price war, and the output value growth was lower than expected.

From the perspective of the future development trend of domestic PCB products, the increase in output is slightly lower than the increase in sales, mainly because the product structure is gradually developing towards multi-layer and high-precision. my country's multi-layer boards and HDI boards are in the growth period of the industry, the scale is constantly expanding, and the technology is becoming more and more mature. Multilayer boards are still the mainstream of market development; and HDI boards are in a period of rapid development driven by the demand for upgrading downstream electronic information products.