PCB aluminum substrate is a metal-based copper clad laminate with good heat dissipation function. Generally, a single panel is composed of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. The general structure of the double-sided board is a circuit layer, an insulating layer, an aluminum base, an insulating layer, and a circuit layer. The multi-layer board can be formed by bonding a common multi-layer board, an insulating layer, and an aluminum base. PCB aluminum substrate has good thermal conductivity, electrical insulation properties and mechanical processing properties.

　　What are the characteristics of PCB aluminum substrate

　　 Features:

　　1, PCB aluminum substrate surface mount technology (SMT); PCB aluminum substrate has good heat dissipation performance in the circuit design scheme;

　　2, PCB aluminum substrate can lower the temperature, improve the power density and reliability of the product, and extend the service life of the product;

　　3, PCB aluminum substrate can reduce the volume and reduce the cost of hardware and assembly;

　　4, PCB aluminum substrate can replace ceramic substrate to obtain the best mechanical endurance.

　　 Application range:

　　 1. Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, pre-amplifiers, power amplifiers, etc.

　　 2. Power supply equipment: switching regulators, DC/AC converters, SW regulators, etc.

　　3. Communication electronic equipment: high-frequency amplifiers, filter appliances, and transmission circuits.

　　 4. Office automation equipment: motor drives, etc.

　　 5. Automobile: electronic regulator, ignition, power controller, etc.

　　 6. Computer: CPU board, floppy disk drive, power supply unit, etc.

　　7. Power module: converter `solid relay` rectifier bridge, etc.

　　Aluminum substrates are generally stored in a dark, dry environment. Most aluminum substrates are prone to moisture, yellowing and blackening. Generally, they should be used within 48 hours after opening the vacuum package.