Copper foil is a kind of negative electrolytic material, a thin, continuous metal foil deposited on the base layer of the circuit board, which acts as the conductor of the PCB. It easily adheres to the insulating layer, accepts the printed protective layer, and forms a circuit pattern after corrosion. What is the role of the copper foil of the aluminum substrate? The copper foil of the aluminum substrate is also called the circuit layer of the aluminum substrate. It is the conductor of the aluminum-based circuit board and also a kind of cathode electrolytic material, which is generally deposited on the base layer of the circuit board. Thin, continuous metal foil.

　　Copper foil has low surface oxygen characteristics and can be attached to various substrates, such as metals, insulating materials, etc., and has a wide temperature range. The copper foil of the aluminum substrate is easily adhered to the insulating layer and accepts the printed protective layer. After corrosion, the pattern of the circuit is formed. It can usually be divided into rolled copper foil (RA copper foil) and electrolytic copper foil (ED copper foil). The copper foil is 1-8OZ (about 35um-350um). Generally, the copper foil (circuit layer) of the aluminum substrate is etched to form a printed circuit, so that the various components of the assembly are connected to each other. Under normal circumstances, the circuit layer (aluminum substrate copper foil) needs to have great current-carrying ability, so copper foil with a thickness of 35um-280um should be used. Someone asked whether the thickness of the copper foil of the aluminum substrate determines its service life? In fact, this relationship is not big, mainly because the role of the copper foil of the aluminum substrate is to conduct electricity. However, the thermal conductivity of the aluminum substrate will affect the service life of the copper foil.