Immersion gold adopts the method of chemical deposition, which generates a layer of plating layer through chemical oxidation-reduction reaction method, which is generally thicker. It is a kind of chemical nickel-gold layer deposition method, which can reach a thicker gold layer.

　　Gold plating uses the principle of electrolysis, also called electroplating. The surface treatment of other metals is mostly electroplating.

　　In actual product applications, 90% of the gold plates are immersion gold plates, because the poor weldability of the gold plate is his fatal shortcoming, and it is also the direct reason why many companies abandon the gold plating process!

1. Immersion gold is different from the crystal structure formed by gold plating. Immersion gold is much thicker than gold plating. Immersion gold will be golden yellow, which is more yellow than gold plating (this is one of the ways to distinguish between gold plating and immersion gold. One), the gold plated will be slightly whitish (nickel color).

　　2. The crystal structure formed by immersion gold and gold plating is different. Immersion gold is easier to weld than gold plating and will not cause poor welding. The stress of the immersion gold plate is easier to control, and for products with bonding, it is more conducive to the processing of bonding. At the same time, it is precisely because the immersion gold is softer than the gilding, so the immersion gold plate is not wear-resistant as the gold finger (the disadvantage of the immersion gold plate).

　　3. The immersion gold board only has nickel and gold on the pads. In the skin effect, the signal transmission is on the copper layer and will not affect the signal.

　　 4. Immersion gold has a denser crystal structure than gold plating, and it is not easy to produce oxidation.

　　5. As the precision requirements of circuit board processing are getting higher and higher, the line width and spacing have been below 0.1mm. Gold plating is prone to short circuit of gold wire. The immersion gold board only has nickel gold on the pad, so it is not easy to produce gold wire short circuit.

　　 6. The immersion gold board only has nickel and gold on the pads, so the solder mask on the circuit and the copper layer are more firmly bonded. The project will not affect the spacing during compensation.

　　7. For the boards with higher requirements, the flatness requirements are better. Generally, the immersion gold is used, and the immersion gold generally does not appear the phenomenon of black pads after assembly. Immersion gold plate has better flatness and service life than gold plate.