The pcb aluminum substrate is what we often call the aluminum-based circuit board, referred to as the aluminum substrate, which is a metal-based copper clad laminate with good thermal conductivity, electrical insulation properties and mechanical processing properties. At this stage, the common PCB aluminum substrate material is metal-based copper clad laminate (mainly aluminum-based and copper-based, and a small part is iron-based).

Metal aluminum-based copper clad laminate is a type of plate-shaped material made of electronic fiberglass cloth or other reinforced materials impregnated with resin, singulation resin, etc. as the insulating adhesive layer, one or both sides covered with copper foil and hot pressed. , Mainly used for processing and manufacturing pcb aluminum substrates, which are commonly used in televisions, radios, computers, computers, mobile communications, LED lighting and other products.

　　The advantages of pcb aluminum substrate

　　 1. The heat dissipation is significantly better than the standard FR-4 structure.

　　2. The dielectric used is usually 5 to 10 times the thermal conductivity of traditional epoxy glass and 1/10 of the thickness.

　　3. The heat transfer index is more effective than traditional rigid PCB.

　　 4. You can use copper weights lower than those shown in the IPC recommended chart.

As the substrate material in the production of PCB aluminum substrates, metal aluminum-based copper clad laminates are mainly used for connection, conduction, insulation and support for PCB aluminum substrates, and have a large impact on the transmission speed, energy loss and characteristic impedance of the signal in the line. Interference. The performance, quality, processability in production, manufacturing level, manufacturing cost and long-term reliability and stability of pcb aluminum substrates are basically determined by metal aluminum-based copper clad laminates.