By summarizing the factors that affect the integrity of the signal, the PCB design process better ensures signal integrity, and can be considered from the following aspects.

(1) Considering circuit design. Including controlling the number of synchronous switching outputs, controlling the maximum edge rate (DI/DT and DV/DT) of each unit, to obtain the lowest and acceptable edge rate; select the differential signal for high output function blocks (such as clock drivers); in the transmission line The upper end is connected to the passive element (such as resistance, capacitance, etc.) to achieve impedance matching between the transmission line and the load.

(2) The wiring length of the minimum parallel wiring.

(3) The component should be left away from the I/O interface and other areas that are easily interfered and coupled.

(4) Short the distance between the signal wiring to the reference plane.

(5) Reduce wiring impedance and signal driving level.

(6) Terminal matching. Can increase the terminal matching circuit or matching element.

(7) Avoid parallel wiring wiring, provide sufficient wiring interval between the wiring, and reduce the inductance coupling.