1. From the specific circuits and functions of the board, you can choose whether the circuit on the board needs to use the corresponding test point.

2. There should be positioning holes of 2 or more.

3. The size requirements of the positioning hole are between 3 ~ 5mm, and the position is generally asymmetric.

4. The location of the test point should be on the corresponding welding surface

5. Each test needle can withstand the current of 2A.

6. Provide an underground test point for every 5 integrated circuit chips

7. For the surface -sticker components, their pads cannot be used as the corresponding test point

8. For components, integrated circuit chips, or plug -in, the pins spacing that needs to be tested should be multiple of 2.54mm.

9. The printed circuit board used for testing should include the edge of the standardized process. For the length or width of the board, it should leave a low -low bumper point that meets the standard.

10. The shape and size of the test point, generally choose a square or circular pad, the size is not less than 1mm*1mm

11. The test point should be locked, and it should be labeled.

12. The test spacing should be greater than 2.54mm, and the distance between the components on the test point and the welding surface should be greater than 2.54mm.

13. The distance from the test point to the positioning hole should be greater than 0.5mm, and the distance from the test point to the edge of the board should be greater than 3.175mm.

14. The distance between the low -voltage test point and the high -voltage test point should meet the requirements of safety norms.

15. The density of the test point should not be greater than 4 ~ 5/cm2, and it should be distributed evenly as possible.

16. Lead the test point to the connection or connect to the cable to test.

17. The height of the component of the welding surface generally cannot exceed 3.81mm

18. The test point cannot be covered by other pads or glue to ensure the reliability of the probe.