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Discover the cause of process problems caused by PCB processing(2)

Time:2023-03-15 Visit:


1. The process of processing equipment will be used, such as: inner front processing line, plating a copper before processing line, D/F, welding (welding) ... and so on.



2. Take the pre-treatment line of hard board PCB anti-welding (welding) as an example (different manufacturers are different): Brushing*2 groups-> Washed-> Pickle-> Washed Sword-> drying section -> Sun Discare Board-> Materials to collect boards.


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3. Generally, the gold steel brush of #600 and #800 is used, which will affect the degree of roughness of the plate surface and affect the adhesion of the ink and the copper surface. After a long period of use, if the product is not left or right, it is easy to produce the dog bone, which will cause unevenness of the plate surface or even the deformation of the line and even after printing. , So you need to brush the work. You need to do brush marks test before brushing operation (when D/F, you need to add water breaking test), and the amount of brushing marks is about 0.8 ~ 1.2mm. After brushing, you need to be corrected for the level of the brush wheel, and you need to add regular lubricating oil. If the water is not turned on when the brushing, or if the voltage is too small and the fan -shaped angle is not fascinated, the copper powder will be easily produced. The slight copper powder will cause a slight short circuit (dense line area) or unqualified high -voltage test during the test of the finished product test. Endog.



During the previous treatment of another problem with the problem of oxidation of the surface of the plate, this will cause the plate surface to bubble or the empty bubbles after H/A.



1. The location of the solid water -shield wheels in the front process is incorrect, so that the acid to the water washing section is too much. If the amount of water washing tank is insufficient or the amount of water is injected, it will cause acid residues on the plate surface.


2. The water quality of the water washing section, or when there is impurities, can also make the copper surface with a foreign body attachment.



3. If the water absorption and roller wheels are dry or water -absorbing, it will not be able to effectively take away the water on the product, which will make the residual water on the board and the residual water in the hole. At this time, most of the empty bubbles will be on the edge of the pilot, tear -like.



4. When the temperature of the material is still, there is still a hemation of the board when there is no temperature, which will oxidize the copper surface in the board.



Generally speaking, you can use the pH value of the pH detector to monitor the pH value, and use the infrared measuring plate surface to produce the remaining temperature of the material. A sun disk collection device is installed between the discharge and the overlap. Wetness needs to be stipulated. It is best to have two groups of water absorption wheels for alternate cleaning. The angle of the wind knife needs to be confirmed before daily operations, and pay attention to whether the drying duct is dropped or damaged.