1. Considering the two aspects of cost and signal quality, choose a reasonable size of the hole. For example, for the PCB design of the 6-10-layer memory module, it is better to choose 10/20mil (drilling/pad). For some high-density small-sized boards, you can also try to use the excess of 8/18mil hole. Under the current technical conditions, it is difficult to use smaller -sized perforated. For the over -holes of the power supply or ground line, you can consider using larger sizes to reduce impedance.

     2. The two formulas discussed above can be concluded that using a thin PCB board is conducive to the two parasitic parameters that reduce the holes.

     3. Try not to change the signal wiring on the PCB board, that is, try not to use unnecessary perforated.

     4. The pipes of the power supply and the ground should be hit nearby. The shorter the lead between the perforated and the tube, the better because they will increase the inductance. At the same time, the power supply and ground lead should be as thick as possible to reduce impedance.

     5. Place some grounding holes near the extension of the signal change layer to provide a relatively close loop for the signal. You can even place some excess ground holes on the PCB board.